Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 11 Jun 1998 12:48:01 -0400 |
Content-Type: | text/plain |
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Ernst, I've seen 5 defects per million joints as a generic target for PBGA
assembly defects. I haven't seen any data or parato analysis to support this
number though.
> -----Original Message-----
> From: Chan, Marcelo [SMTP:[log in to unmask]]
> Sent: Thursday, June 11, 1998 9:34 AM
> To: [log in to unmask]
> Subject: Re: [TN] BGA First Time Yields
>
> Ernst,
>
> Can you be more specific to as what you consider a defect..if bridging,
> component placement and insufficient/non-wetting are your only criteria
> then 96%
> seems low even for prototype development.....but that depends on the
> quality of
> your BGA devices as well....
> Marcelo
>
> -----Original Message-----
> From: Wallisch, Ernst [SMTP:[log in to unmask]]
> Sent: Thursday, June 11, 1998 11:26 AM
> To: [log in to unmask]
> Subject: [TN] BGA First Time Yields
> Importance: High
>
> Fellow Technetters,
>
> I am fairly new to the world of BGAs and we have only
> built
> limited
> quantities of CCAs with BGAs (388s and 352s on 17 layer PWBs) for
> internal
> customers. I am seeing a first time yield of approximately 96%.
>
> Is this particularly bad for a low to mid volume
> environment?
> What
> kinds of FTY are other folks achieving?
>
> Thanks in advance,
>
> Ernst Wallisch
> Manufacturing Engineering
> Computing Devices Canada
> [log in to unmask]
> (613) 596-7536
>
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