Are Surface mount ICs glued on solderside of board?
Based on my earlier experience on IC assembly, I can suggest you to look
at the following:

Permanancy of Marking on IC surface can be improved by:
1. Using matt finish top surface . That might require
refurbishing/change of molds if your mold is designed for mirror finish.
2. Using high temp chem resistant inks. Markem Corp. might be able to
help you.
3. Laser mark the Ics -these days laser markers are quite competitive.
4. Try different combinations of flux and inks for compatibility.



> ----------
> From:         Aura Esporalas[SMTP:[log in to unmask]]
> Sent:         June 10, 1998 12:57 PM
> To:   [log in to unmask]
> Subject:      [TN] component  marking
>
> Hi!
>
>
> Please help me to find solution to my problem regarding  IC(Surface
> mount Device)  top marking  erasure.  Process flow  like does
> ........ adhesive dispense--manual placement--adhesive during--manual
> insert--solder wave--inspection station----
>
> Evaluation  made.
> 1. Scratch  With IPA but  top mark was  not erase.
> 2. Heat it with solder iron tip with solder wire to know that if flux
> contributes the erasure of the top mark.
>
>
> Regards,
>
>
>
>
>
> ELECTRONIC ASSEMBLIES INC.
> [log in to unmask]
> tel#: 8237317/759-3884
> fax#: 759-8629
>
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