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Thu, 4 Jun 1998 18:21:37 -0500 |
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How about excluding oxygen and moisture?
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From: Stefan Pollmeier[SMTP:[log in to unmask]]
Reply To: TechNet E-Mail Forum.;Stefan Pollmeier
Sent: Thursday, June 04, 1998 12:29 PM
To: [log in to unmask]
Subject: [TN] Reflow soldering: forced gas vs. infra-red
Dear TechNetters,
a contract manufacturer has problems in controlling the soldering
process after switching to forced gas (from infra-red).
One idea was letting us change land patterns ("my experience: oval works
better than rectangular"). Any experience reports, hints, literature
regarding land patterns _and_ soldering process would be welcome.
Any hints on process optimization we could forward to our contract
manufacturer are also welcome (is there a "top ten faults in forced gas
convection soldering"?).
Thank you very much in advance.
Best regards
Stefan Pollmeier
--
Stefan Pollmeier [log in to unmask]
ESR Pollmeier GmbH Tel. +49 6167 9306-0
Lindenstr. 20 Fax +49 6167 9306-77
D-64372 Ober-Ramstadt, Germany
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