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June 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 30 Jun 1998 15:00:13 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Todd Ness <[log in to unmask]>
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text/plain; charset=US-ASCII
Subject:
Wave Solder Pot Temp-63/37
From:
Todd Ness <[log in to unmask]>
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Organization:
Emerson Motion Control
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Authenticated sender is <tness@[150.150.151.220]>
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text/plain (22 lines) 
Hi,

I would like to know the differences between having our solder pot
temp for 63/37 solder at 261 Degrees C instead of 250 Degrees C. Will
we see less bridging and better top-side flow at the higher temp? Are
there any pros and cons for the different temperatures?

Thanks,
Todd N

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