TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Date:
Tue, 30 Jun 1998 15:00:13 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Todd Ness <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
From:
Todd Ness <[log in to unmask]>
Content-transfer-encoding:
7BIT
MIME-Version:
1.0
Organization:
Emerson Motion Control
Comments:
Authenticated sender is <tness@[150.150.151.220]>
Parts/Attachments:
text/plain (22 lines)
Hi,

I would like to know the differences between having our solder pot
temp for 63/37 solder at 261 Degrees C instead of 250 Degrees C. Will
we see less bridging and better top-side flow at the higher temp? Are
there any pros and cons for the different temperatures?

Thanks,
Todd N

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2