TECHNET Archives

June 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Wed, 17 Jun 1998 09:22:47 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Edwin Maximo <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
Assy: chip on glass
MIME-Version:
1.0
Content-transfer-encoding:
7BIT
From:
Edwin Maximo <[log in to unmask]>
Comments:
Authenticated sender is <emaximo@[192.1.1.215]>
Parts/Attachments:
text/plain (22 lines) 
I'm investigating the  chip on glass process for a new product that
our company will be doing. I would appreciate if anybody could share
some of their experiences with this technology, the issues involved
with this technology.

Regards,
Edwin Maximo
Electronic Assemblies Inc.
email: [log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2