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June 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Wed, 10 Jun 1998 17:57:11 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Aura Esporalas <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
component marking
MIME-Version:
1.0
Content-transfer-encoding:
7BIT
From:
Aura Esporalas <[log in to unmask]>
Comments:
Authenticated sender is <aesporlas@[192.1.1.215]>
Parts/Attachments:
text/plain (37 lines) 
Hi!


Please help me to find solution to my problem regarding  IC(Surface
mount Device)  top marking  erasure.  Process flow  like does
........ adhesive dispense--manual placement--adhesive during--manual
insert--solder wave--inspection station----

Evaluation  made.
1. Scratch  With IPA but  top mark was  not erase.
2. Heat it with solder iron tip with solder wire to know that if flux
contributes the erasure of the top mark.


Regards,





ELECTRONIC ASSEMBLIES INC.
[log in to unmask]
tel#: 8237317/759-3884
fax#: 759-8629

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