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June 1998

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From:
Bill Davis <[log in to unmask]>
Date:
Mon, 1 Jun 1998 09:12:21 -0700
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1.0
X-To:
"Bobby R. Mangona" <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Bill Davis <[log in to unmask]>
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Bobby:
First make sure the parts are not suffering from board lay-out misorientation. The length axis of the cap should be parallel to the width axis of the board. Next, what are you spec'ing for termination materials? If you are not buying nickel barrier terminators, it is likely that you have a tin composite terminator & are abosrbing this into you solder paste during reflow.

Regards,
Dr. Bill

> -----Original Message-----
> From: Bobby R. Mangona [SMTP:[log in to unmask]]
> Sent: Monday, June 01, 1998 6:09 AM
> To:   [log in to unmask]
> Subject:      [TN] (Fwd) Termination Loss
>
> ------- Forwarded Message Follows -------
> From:          Self <bobby>
> To:            TECHNET
> Subject:       Termination Loss
> Date:          Sat, 30 May 1998 08:45:51
>
> We are experiencing termination loss of chip capacitors and chip
> resistors after the reflow process.
> Can anyone told me the possible causes?
> Is it a material related problem?Since we have already checked the
> reflow profile and found to be within specification.
>
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