DESIGNERCOUNCIL Archives

June 1998

DesignerCouncil@IPC.ORG
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Sender:
DesignerCouncil <[log in to unmask]>
Date:
Mon, 1 Jun 1998 12:44:00 -0700
Reply-To:
"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Walter Williams <[log in to unmask]>
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Subject:
Land pattern Question
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Organization:
I-O Corporation
From:
Walter Williams <[log in to unmask]>
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There is some information that I left off. The Intel data sheet also
says it is a 40 pin package. A little over sight on my part.

TSOP 10x20 40 pin


*************************************************
Thanks
Walter L. Williams, Circuit Board Designer
I-O Corporation, SLC, Utah
Industry leader in IBM AS400 connectivity products
[log in to unmask]
Voice: 1-801-972-3558 ex 123
Alternate: 1-801-973-6767
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Carpe Diem

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