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May 1998

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Subject:
From:
Byrns Nancy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 May 1998 09:43:06 -0400
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Hi everybody

We have Rigid Printed Board, class 3 for military we need to do.
We refer to IPC-D-275 paragraph 5.5.1 solder resist coating because we
have a conductor width 0.100" and the coating completely cover this
conductor.
We want to know which pattern we should use to have a good solder resist
coating adhesion to the melting metal surface??
Which pattern are normally use in production for those conductor width??

Thanks you,
Nancy Byrns
Oerlikon Aerospace

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