To: North Texas PCB Designers, Fabricators, Manufacturers, et al
From: Glenn Miner / Denise Dunn
RE: North Texas Chapter ~ IPC Designers Council Meeting May 7th @ 6:30PM
********************************************************************
"MicroVias, PhotoVias, and Redistribution Layers"
PLUS
IPC Certification Overview and Sample Test
(If you're considering IPC Certification, you should attend THIS
meeting.)
May Chapter Meeting Sponsored By
Tyco Printed Circuit Group -- Bill Earthman
********************************************************************
THANK YOU
Kile Brown and Source Engineering
for hosting the March chapter meeting
"Questions Your Fabricator Wished You'd Ask!"
AND, THANK YOU to our panel participants
Keith Larson, Circuit Technology, Inc. (TX)
Jim McNeal, Electro Plate Circuitry (TX)
Nilesh Niak, Eagle Circuits, Inc. (TX)
Pam Bruner, Winonics, Inc. (TX)
********************************************************************
CONGRATULATIONS: Door Prize Winners for March:
John Dishong, Bosch Telecom, Inc.--Paid Membership
Dipak Desai, Eagle Circuits--Membership Renewal
Gita Shah, Raytheon Systems Co.--Eagle Circuits Shirt
********************************************************************
* Help spread the word. Forward this as appropriate. *
********************************************************************
The May 7th chapter meeting will be held at the Texins Association
Building on the main campus of Texas Instruments, I635 at Central in
Dallas.
This months topic is "MicroVias, PhotoVias, and Redistribution Layers"
and will be presented by Dr. Puligandla Viswanadham, Senior Member ot
the
Technical Staff at Raytheon Systems Company.
ABSTRACT:
The phenomenal growth in global communication and the insatiable
consumer
appetite for mobile information processing are facilitating rapid
evolution in
semiconductor packaging. Smaller and smaller packages with ever
increasing
functionalities are being introduced. The demand for lighter, smaller,
faster
and cheaper products is on the increase. The printed wiring board and
assembly
technology is entering a major new era of high density packaging.
Current PWB
technologies are at their limits in terms of materials, and process
capabilities. The PWB industry is slowly imbibing semiconductor
mentality to
meet the needs of the industry.
One of the new PWB technologies being vigorously pursued is the build-up
multilayer technology using fine line and via circuitization. The
technology is
variously called surface laminar circuitry, redistribution layer
technology,
micro-via technology, etc. In this presentation will be provided an
overview of
this rapidly emerging and maturing technology. Some of the techniques
that are
used to produce the micro-vias will be described along with their
comparative
merits. Current capabilities of the industry and the limitations will be
highlighted.
Dr. Puligandla Viswanadham is a Senior Member of the Technical Staff at
the
Lewisville facility of the Ratheon Systems Company. His current
responsibilities at Raytheon include development, and deployment of
emerging
and maturing technologies such as ball grid array technology, chip scale
packages into military hardware. Prior to joining Raytheon he was with
International Business Machines Corporation at Austin(TX),
Rochester(MN), and
Endicott(NY). He was member of the process development group for the
Surface
Laminar Circuitry at IBM, Austin.
He has co-authored well over seventy technical publications, four book
chapters, and most recently co-authored a book titled Failure Modes and
Mechanisms in Electronic Packages published by Chapman and Hall.
******************************************************************************
Date: Thursday, May 7th
Time: 6:30pm
Location: Texins Association Building, Texas Instruments, I635 @ Central
******************************************************************************
AGENDA:
6:30-6:55 Refreshments and networking.
6:55-7:00 Opening remarks
7:00-7:35 "MicroVias, PhotoVias, and Redistribution Layers"
Dr. Viswam Puligandla
7:35-7:45 Question & Answer period
7:45-7:50 Discussion--Certification Training and Test Overview
Glenn Wells
7:50-8:00 Sample Certification Test (Timed)
8:00 Adjourn
8:00-9:00 Meeting wrap-up (optional)
******************************************************************************
DIRECTIONS TO Texins Association (Texas Instruments, 13500 N Central
Expy,
Dallas, TX 75243):
FROM EASTBOUND OR WESTBOUND LBJ (I635)-
Exit NORTH on 75 (Central Expressway). Immediately exit at Midpark.
Follow
service road to traffic light at Midpark. Turn right into the Texas
Instruments
facility (open access to parking areas). Turn left after entering the
parking
lot and follow road straight until it ends at a fence. Texins
Association
building will be on your left. Park anywhere near the building.
FROM SOUTHBOUND CENTRAL EXPRESSWAY (75)-
Exit at Midpark (next exit past Spring Valley). Turn left at the traffic
signal
at Midpark and cross over Central Expressway and follow straight into
the
Texas
Instruments facility (open access to parking areas). Turn left after
entering
the parking lot and follow road straight until it ends at a fence.
Texins
Association building will be on your left.
FROM NORTHBOUND CENTRAL EXPRESSWAY (75)-
Exit at Midpark (next exit past LBJ). Turn right at the traffic signal
at
Midpark and the service road into the Texas Instruments facility (open
access
to parking areas). Turn left after entering the parking lot and follow
road
straight until it ends at a fence. Texins Association building will be
on
your
left. Park anywhere near the building.
Enter at the main entrance, conference rooms are at the end of the hall
to the
right (past child care room).
******************************************************************************
PREVIOUS CHAPTER MEETINGS:
May '97 Organization meeting at CADCO System, Inc. In Garland, TX.
Jun '97 Tour of North Texas Circuit Board in Grand Prairie, TX.
Aug '97 Viewing of IPC video "Design Considerations", one of seven video
tapes
from the IPC-D-275 PWB Design Workshop series.
Oct '97 Speaker: Mark Bouril. Topic: Frequency dependence of
dielectric
constant and loss tangent.
Dec '97 Plant tour Specialty Photo-Etch, Inc. in Grand Prairie, TX.
Jan '98 "College Curriculm for the PCB Designer" CCCCD
Mar '98 "Questions Your Fabricator Wished You'd Ask!" Panel discussion
1998 CALENDAR:
CHAPTER MEETINGS:
Date: Thursday, July 9
Time: 6:30-8:30pm
Topic: TBD
Location: Texins Association Bldg., Texas Instruments LBJ@75
Presented by:
Sponsored by: Eagle Circuits
CORE GROUP MEETINGS:
Date: Thursday, June 4
Time: 6:30pm
Location: Cheddars Restaurant on the SW corner of Greenville at LBJ for
dinner
meeting (dutch).
For more information please call Glenn Miner at 972-462-2298 or email at
[log in to unmask]
Visit IPCs web site at http://www.ipc.org
If you complete the on-line Designers Council registration, BE SURE to
affiliate with the North Texas Chapter. You may fax it to Christine
Myrick at
847-509-9798
=====================================================
| Denise Dunn Customer Service Specialist |
| Zuken-Redac, Inc. Tel: 972.770.5447 |
| 12790 Merit Dr. Fax: 972.770.5481 |
| Suite 520 Email: [log in to unmask] |
| Dallas, TX 75151 Web: http://www.redac.co.uk |
=====================================================
Glenn Miner
Voice: 972-462-2298
Pager: 972-597-8929
EMail: [log in to unmask]
:)
|
