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May 1998

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Subject:
From:
Dennis Gagne <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 May 1998 21:19:23 -0400
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Hi,
        Does anybody know any good resources (i.e tech papers)that go into detail
describing the process variables that effect the plasma etchback process.
I am particularly interested in any papers that deal with etching high
aspect ratio holes, or etching distribution within a chamber.

Thank you in advance for your response

D Gagne

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