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May 1998

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Subject:
Re: Solder GOLD plated connector to PCB's
From:
Lenny Kurup <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 May 1998 11:35:28 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (23 lines) 
The thickness of solder required to circumvent a gold-embrittlement
problem,  increases rapidly with increasing gold thickness. Dwell times in
the Levelling and/or Fusing process will have to be increased, temperatures
and other parameters, that will pose a detrimental effect on the circuit
laminate, will have to be adjusted to increase the thickness well above 1/4
mil.

Regards,
Lenny Kurup
EMX Enterprises Ltd.

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