At 16:10 30/04/98 -0700, you wrote:
>TechNet,
>
>As we all know HASL has been the work horse in the industry for several
>years as an excellent surface finish.


>The problem is the lead content as
>it pertains to hazard waste,

I wasn't aware there was a hazardous waste from the use of lead in assembly.
The unused paste and wave solder dross can all be recycled, so where is the
problem after that?

> which is forcing the electronic industry to
>find an alternative.

Who is doing the forcing? Is there a world wide organization putting
pressure on assembly companies to remove lead from the assembly process? Who
outside the electronics industry (politicians, academics, the man on the
street..etc.) is aware or considers that lead is used in the assembly process?

What are the facts regarding the hazards of lead in assemblies?

Is this pressure coming from organizations in electronics assembly nations
such as Malaysia, Taiwan, Ireland, Mexico.....?

Do you have an alternative to soldering with lead? If so can you share the
process details with us all?

Regards

Eddie

>
>We are in the process of evaluating alternative surface finishes:
>
>1.)  Florida CirTech's OMIKRON process(Tin)
>2.)  Alpha Metal's Alpha Level
>3.)  DEXTER's product
>
>I would greatly appreciate any and all feed back as it pertains to any
>alternatives to HASL.   Your responces would be greatly appreciated.
>Please keep in mind the following items:
>
>1.)  SIR Testing
>2.)  Electromigration
>3.)  Solder Wettability
>4.)  Heat Cycling
>5.)  Aging Test
>6.)  Reworkablity
>7.)  Ionic Contamination
>
>Thank you for your responses,
>
>Nate Natzke
>[log in to unmask]
>
>Tri-Star Engineered Products, Inc.
>351 Thor Place
>Brea, CA 92821
>
>Phone: (714) 671-1545
>Fax:   (714) 671-1124
>
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