I am certainly not an expert in soldering or solder joint reliability, but
isn't the gold thickness just one parameter to consider when one is worried
about embrittlement? Reflow time, reflow temperature, pad size, etc.
should also be considered. In some designs, I would think that it is
possible to have a reliable solder joint even though more that 30
microinches of gold is used as the surface finish.
Dave Anderson
Medtronic, Inc.
Opinions are strictly my own, and do not necessary reflect those of my
employer.
>>> Lenny Kurup <[log in to unmask]> 05/01/98 08:42am >>>
Hello Corey,
It is recommended that you not solder over a gold thickness of 30 uins, you
will have gold embrittlement caused by the AuSn, intermetallic. If however,
you reduced the gold thickness to < 10 uins, the solder joints will be
stronger, with soldering to the nickel, beneath, occuring.
Regards,
Lenny Kurup
EMX Enterprises Ltd.
On Mon, 27 Apr 1998, Cory and Lise Steeby wrote:
> We are evaluating a fully gold plated (30uin) connector for a new
product.
> I have heard that soldering a gold plated connector to a PCB can cause a
> brittle solder joint because of the intermetallic bonds made between the
> gold and solder. The assembly is through-hole and wave soldered. Gold
> plating is required of the contact portion of the connector because of
> environment and signal levels. I am trying to weigh the gold contact pro
> against the gold solder joint con.
>
> Can anyone verify this or point me to evidence that this is not a
problem?
>
> Thank You
>
> Cory Steeby
> [log in to unmask]
>
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