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May 1998

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Subject:
25mil SMT connectors, 16mil TQFPs (14mm package), 0402 chips
From:
Yves Trudell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 May 1998 15:59:31 -0400
Content-Type:
text/plain
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text/plain (25 lines) 
Hi, we are planning to start assembling PCBAs with the following
technologies:
*       25mil SMT connectors
*       16mil TQFPs (14mm package)
*       0402 chips

I'm interested in knowing what kind of placement/soldering defect levels are
associated with each of these packages.  Any help would be appreciated.

Yves Trudell
Nortel, Wireless Networks Calgary
Quality System Engineering

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