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May 1998

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Subject:
From:
Nick Nicolaides <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 May 1998 18:07:34 -0400
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Exposed copper on solder resist is considered a non conformance per IPC600.
I can understand exposed copper with OSP since it does burn off during
Reflow and Wave soldering. In some cases copper is not tin lead. In several
operations, we seem to have the solder mask peel off slightly exposing
copper. Should this be acceptable similar to OSP.

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