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May 1998

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Subject:
From:
Jared Lang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 May 1998 08:55:13 -0700
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Hi Rob,

We had a similar problem where a number of DO-214AB diodes on the bottom
of the board could be easily knocked off in handling or in wavesolder.
We were using Heraeus 86002SP glue.  We found that the epoxy used to
manufacture the diodes still had a small amount of the mold release
compound.  We switched to Heraeus PD955M which has a higher shear factor
and it solved the problem.  Granted, you are using metal 1206 jumpers,
but the solution may be as simple as changing the type of glue.


Regards,

Jared Lang
Manufacturing Engineer
Minarik Corp.
> ----------
> From:         [log in to unmask][SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Thursday, May 28, 1998 5:27 AM
> To:   [log in to unmask]
> Subject:      [TN] 1206 jumper
>
> I have a component that is glue cured on the bottom of a pcb.  The
> component is a 1206 size jumper.  It is made up of iron/nickel alloy.
> The
> problem I am having is that the part will fall off the board during
> wave
> solder.  Is the component not able to withstand all the heat of the
> solder
> pot being that it is a solid metal material?  Any ideas or solutions
> would
> be appreciated.
>
> Rob Williams
> [log in to unmask]
>
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