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May 1998

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Subject:
From:
David Heywood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 May 1998 14:53:22 +0100
Content-Type:
text/plain
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text/plain (55 lines)
Half an hour at above 150C lying flat and supported will relieve any   
pressing stresses. If there is any doubt about the state of cure increase   
the temperature to 170C. With copper in place you will do no harm to the   
material and may solve some of the problems associated with bow and   
twist. However do not bother to bake unless you think you need to or have   
a specific problem. Please feel free to contact me (off-TechNet) if you   
have any specifics.
Regards,
David Heywood.

 -----Original Message-----
From: [log in to unmask]
Sent: 05 May 1998 11:32
To: [log in to unmask]; Dave Heywood
Subject: [TN] Multilayer Lamination Post-Bake

 << File: ENVELOPE.TXT >>
 --------------------------------------------------------------------------  
 --
Is it necessary to bake multilayer board (FR 4)  after hot press?
What should be the post-bake condition?
Thank you

Best Regards,

Chan Chi Man

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