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May 1998

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Subject:
From:
Charles Barker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 May 1998 08:28:35 -0500
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Charles Barker@I-O INC
05/28/98 08:28 AM

Hi Rob,

Have you checked the parameters of the glue being used? We had a similar
problem for regulat resistors and capacitors.  Turned out that the process
folks were stretching the "pot life" too much.  Is your curing process
correct? You might want to talk to someone like Loctite for more specifics.

Good luck!

Charlie B.



Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Charles Barker/US/I-O INC)
Subject:  [TN] 1206 jumper


I have a component that is glue cured on the bottom of a pcb.  The
component is a 1206 size jumper.  It is made up of iron/nickel alloy.  The
problem I am having is that the part will fall off the board during wave
solder.  Is the component not able to withstand all the heat of the solder
pot being that it is a solid metal material?  Any ideas or solutions would
be appreciated.

Rob Williams
[log in to unmask]

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