> It sounds as if you have an adhesion problem.
> Does the residual glue stil have the flat impresasion from the chip?
> What type of adhesive is being used? Some are stronger adhesives than
> others.
> A metal chip has a completely different surface tooth thanthat of a
> ceramic chip.
> Points to ponder.
>
>       -----Original Message-----
>       From:   [log in to unmask] [SMTP:[log in to unmask]]
>       Sent:   Thursday, May 28, 1998 8:28 AM
>       To:     [log in to unmask]
>       Subject:        [TN] 1206 jumper
>
>       I have a component that is glue cured on the bottom of a pcb.
> The
>       component is a 1206 size jumper.  It is made up of iron/nickel
> alloy.  The
>       problem I am having is that the part will fall off the board
> during wave
>       solder.  Is the component not able to withstand all the heat of
> the solder
>       pot being that it is a solid metal material?  Any ideas or
> solutions would
>       be appreciated.
>
>       Rob Williams
>       [log in to unmask]
>
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