It sounds as if you have an adhesion problem.
Does the residual glue stil have the flat impresasion from the chip?
What type of adhesive is being used? Some are stronger adhesives than
others.
A metal chip has a completely different surface tooth thanthat of a
ceramic chip.
Points to ponder.

> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Thursday, May 28, 1998 8:28 AM
> To:   [log in to unmask]
> Subject:      [TN] 1206 jumper
>
> I have a component that is glue cured on the bottom of a pcb.  The
> component is a 1206 size jumper.  It is made up of iron/nickel alloy.
> The
> problem I am having is that the part will fall off the board during
> wave
> solder.  Is the component not able to withstand all the heat of the
> solder
> pot being that it is a solid metal material?  Any ideas or solutions
> would
> be appreciated.
>
> Rob Williams
> [log in to unmask]
>
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