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May 1998

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Date:
Thu, 28 May 1998 07:27:50 -0500
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I have a component that is glue cured on the bottom of a pcb.  The
component is a 1206 size jumper.  It is made up of iron/nickel alloy.  The
problem I am having is that the part will fall off the board during wave
solder.  Is the component not able to withstand all the heat of the solder
pot being that it is a solid metal material?  Any ideas or solutions would
be appreciated.

Rob Williams
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