Call for Supplier Participation in Manual Soldering Iron Round Robin Testing

IPC Task Group 5-22c (Manual Soldering Task Group) will be conducting a Round Robin
on proposed Test Methods 2.5.33 series (Measurement of Electrical Overstress from
Soldering Hand Tools) in support of ANSI/J-STD-001. The round robin will be conducted
at the EMPF <website - http://empf.arl.psu.edu/ > Indianapolis Indiana, on July 28th
with July 29th scheduled as an additional day if needed.  July 27th has been
designated as a day for equipment set-up and for suppliers to evaluate and test the
as-received condition of supplied equipment.  As of May 15th the following soldering
equipment suppliers have agreed to supply equipment for the round robin:
Hexacon Electric Company
OK International
PACE Incorporated

Other interested suppliers are invited to participate by supplying equipment and to
participate in the test method evaluation.  Copies of the Test Methods and Round
Robin test plan are available from Jack Crawford <[log in to unmask]> (847) 509-9700
x-393.  Interested parties needing additional information should call Jack or Task
Group chairman Dave Robertson <[log in to unmask]> (908) 245-6200.

Registered suppliers providing equipment need to ship their items to arrive at the
EMPF between July 15 - July 24.  Ship all equipment to:
Mr. Jon Wiener (317) 655-3673 x-106
Attn: IPC Round Robin
EMPF
714 N. Senate Ave.
Indianapolis, IN  46202-3112

Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]        http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

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