Manual Soldering Iron Round Robin Testing, Call for Participation

IPC Task Group 5-22c (Manual Soldering Task Group) will be conducting a Round Robin
on proposed Test Methods 2.5.33 series (Measurement of Electrical Overstress from
Soldering Hand Tools) in support of ANSI/J-STD-001. The round robin will be conducted
at the EMPF <website - http://empf.arl.psu.edu/ > in Indianapolis Indiana, on July
28th with July 29th scheduled as an additional day if needed.

This round robin test program is designed to determine the validity, accuracy, ease
of use, and repeatability of a set of proposed test methods to support
ANSI/J-Std-001B (Appendix A).  The proposed test methods are designated as follows:
--2.5.33  Measurement of Electrical Overstress from Soldering Hand Tools
--2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools - Ground
Measurements
--2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools - Transient
Measurements
--2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools - Current
Leakage Measurements
--2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools - Shielded
Enclosure

End users are encouraged to participate in the round robin as both active
participants and official observers.  Copies of the proposed Test Methods and the
Round Robin test plan are available from Jack Crawford <[log in to unmask]> (847)
509-9700 x-393.  Interested parties needing additional information should call Jack
or Task Group chairman Dave Robertson <[log in to unmask]> (908) 245-6200.

Active participants are invited to bring their own test equipment (per the test plan)
including any fabricated test boxes or screen boxes.  It is mandatory that all
participants register with Jack Crawford at the IPC not later than July 22nd.

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