Dave-
Can you shoot me a copy too? 4Fax: 408-321-4549
thx,
Dr. Bill Davis
> -----Original Message-----
> From: David Gonnerman [SMTP:[log in to unmask]]
> Sent: Wednesday, May 27, 1998 7:33 AM
> To: [log in to unmask]
> Subject: Re: [TN] Reflow Atmosphere
>
> Hi Steve:
>
> Send me your fax number and I will fax "Nitrogen for Flow and Reflow
> Soldering?" by Armin Rahn, Rahn-Tec Consultants. He wrote this last year
> for the SMTA newsletter.
>
> Regards,
>
> -David
>
>
> At 12:37 PM 5/26/98 -0600, you wrote:
> >All,
> >
> >We are just getting into volume SMT production and I have a
> >couple of questions about the benefits of a nitrogen reflow.
> >
> >1) Is there a suggested SMT pitch that almost necessitates
> >the use of nitrogen (i.e. 20 mil does fine without but 16
> >mil needs it...)?
> >
> >2) If we are using 100% mil-std finish parts, boards, and
> >RMA flux solder paste, are the benefits as great as if we
> >were using commercial parts, boards, and a no-clean flux
> >solder paste?
> >
> >3) One of our customers claims that it increases the life
> >of the assembly by eliminating/reducing void formation
> >within the solder connection. Any insight into this?
> >
> >
> >We are in process of qualifying our SMT equipment, materials
> >and processes. Any suggestions, insight, or lessons learned
> >would be greatly appreciated.
> >
> >Thank you all in advance of your help!!
> >
> >Steve McBride
> >[log in to unmask]
> >(405) 624-5281
> >
> >################################################################
> >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> >################################################################
> >To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> >To subscribe: SUBSCRIBE TechNet <your full name>
> >To unsubscribe: SIGNOFF TechNet
> >################################################################
> >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
> information.
> >For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> >################################################################
> >
> >
>
> David Gonnerman
> Director of Publications
>
> Plan now to attend:
> Surface Mount International (San Jose, CA; 8/23-8/27)
> Electronics Assembly Expo (Providence, RI; 10/24-10/29)
>
> SURFACE MOUNT TECHNOLOGY ASSOCIATION
> Enabling members to achieve success
> in surface mount and companion technologies
> through education, training and access to knowledge.
>
> 5200 Willson Road, Suite 215, Edina, MN 55424-1343
> 612-920-7682 F 612-926-1819
> [log in to unmask] www.smta.org
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
