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May 1998

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Subject:
Re: Insufficient Solder
From:
Bill Davis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 27 May 1998 08:03:56 -0700
Content-Type:
text/plain
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text/plain (41 lines) 
Hi Bobby:
I'm fighting the same thing. Insights can be found in toward very interesting articles in the SMT magazine (May, 1997, page 44, The Complete Solder Paste Printing Process, by Richard S. Clouthier, and January, 1998, page 68, Stencil Adhesive Deposition, by Steve Breed). In general everything during the deposition process, squeegee type, pressure, speed, as well as solder paste type, mesh screen size, pad size and stencil size, can affect the acutal amount of solder left behind after the squeegee pass.

Check these articles, especially the first one.

Regards,
Dr. Bill

> -----Original Message-----
> From: Bobby R. Mangona [SMTP:[log in to unmask]]
> Sent: Wednesday, May 27, 1998 6:49 AM
> To:   [log in to unmask]
> Subject:      [TN] Insufficient Solder
>
>         Can any one tell me the possible causes of an insufficient solder
> found after reflow process.
>
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