Hi Steve:
Send me your fax number and I will fax "Nitrogen for Flow and Reflow
Soldering?" by Armin Rahn, Rahn-Tec Consultants. He wrote this last year
for the SMTA newsletter.
Regards,
-David
At 12:37 PM 5/26/98 -0600, you wrote:
>All,
>
>We are just getting into volume SMT production and I have a
>couple of questions about the benefits of a nitrogen reflow.
>
>1) Is there a suggested SMT pitch that almost necessitates
>the use of nitrogen (i.e. 20 mil does fine without but 16
>mil needs it...)?
>
>2) If we are using 100% mil-std finish parts, boards, and
>RMA flux solder paste, are the benefits as great as if we
>were using commercial parts, boards, and a no-clean flux
>solder paste?
>
>3) One of our customers claims that it increases the life
>of the assembly by eliminating/reducing void formation
>within the solder connection. Any insight into this?
>
>
>We are in process of qualifying our SMT equipment, materials
>and processes. Any suggestions, insight, or lessons learned
>would be greatly appreciated.
>
>Thank you all in advance of your help!!
>
>Steve McBride
>[log in to unmask]
>(405) 624-5281
>
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David Gonnerman
Director of Publications
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