Try talking to EPIC Technologies in Woburn MA ( Jim Kohl 932-7870 ).  They do
chip packaging / MCMs / FLIP CHIPS etc where they manufacture a circuit board
using an additive process on top of the chip die with a top layer of flexible
plated bumps rather then solder  bumps ( requiring no under-fill on Flip Chips
), either gold or copper plated which you solder onto boards using standard
SMT processes.  They do approx. 1 mil lines / spaces / and vias giving you the
density to minimize the layer counts.  Give them a try, they may be able to
help you out with the board design and manufacture.




>I am trying to design a small board ( 1" x 1") which I
>want to mount exactly like a real BGA would be assembled.
>Could I please try to solicit information about how 30mil
>balls could be attached to the board for mounting onto
>a mother board.
>thanx.....hg
>

I would think you could treat this like you are reballing a plastic BGA.
There are fixtures (and services) that exist to accomplish this, and
many have been discussed on TechNet in the past, so you could search the
archives for "BGA Reballing".  The folks that I have dealt with for this
are Rich Sentner at Singularity Electronic Systems (603) 430-6000 and
Rich Breault at Netco Automation (978) 372-7715.
It's very straightforward, and I wouldn't think you will have any
problems making the "components".

Hal Winslow
Cadent Medical Corp

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