Hi Sal,
First thing to do, would be to check your phototools, especially if you are
using Daizo films, and check the density. try another pass through the
ammonia developer, and darken it up. Next thing would be to check the
exposure time - are you over exposing?...a step wedge should clear this up,
and figures for the Lea Ronal effective step should be found in the data
sheet. Then try the concentrate on the developing solution...typical
concentration should be around 1-1.5%, and also do a Ph check.



At 14:33 26/05/98 -0400, you wrote:
>   To All
> We are using RONASCREEN OPSR 5600 HARDENER & RONASCREEN 5600
>OPSR 5600 CODE 2D-AU SOLDERMASK. The problem that we are having is after we
>screen the board and tack cure the board at 160 F for 30 min. We then
>expose the board then develop the board. Upon inspection of the board on
>the developed areas we have found small little areas of soldermask all over
>them if we try to develope them again they will not come off. Has anyone
>come across this before if so, how did you fix it?
>Last thing the the areas have Tin Lead on them.
>
>
>
>THANK FOR ANY IMPUT
>   SAL MITICHI
>Modular Components National, Inc.
>2302 Industry Court
>Forest Hill, MD 2150
>PH (410) 879-6553
>Fax (410) 838-7629
>
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