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May 1998

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Subject:
From:
Michael Carano <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 May 1998 21:11:32 -0700
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SteveZeva wrote:
>
> Hi Nicolas!
>
>      As far as the exposed copper that results from an OSP process, there
> isn't an issue as far as I know. Yes the copper will oxidize, but from the
> little bit I know about metallurgy, it's my understanding is that the copper
> will be coated with a layer of oxidation, and then it slows down dramatically.
> For a illustration of that just think about some of the copper water lines in
> old houses, the copper telephone lines exposed to the elements for years and
> years...that shows that it takes quite a while for copper to deteriorate.
>
>      Somebody correct me if I'm wrong about this, but the exposed copper
> problems that are defects usually have something to do with the exposed copper
> being an indicator of some other problem, not the fact that the copper itself
> is exposed. Oxidation of the copper is normally only a problem when trying to
> solder to it...
>
> C-ya,
>
> -Steve Gregory-
>
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> ################################################################Hi Nicolas,
I have come across this question of the exposed copper with respect to
OSP's. While solder paste spreading will vary from paste to paste and OSP
to OSP, no one has ever(to my knowledge) determined that the exposed
copper caused a long term reliability problem. Maybe Jack Crawford at
the IPC can help with this one.

Best regards,

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