TechNet,

I am having trouble with solder balls dinging metal squegee blades on the second
pass of some double-sided boards.  The solder balls usually form due to vias on
the first pass.  Is there any good, quick method for a stencil print operator to
assure that there are no solder balls on a board before it is printed, so the
blades will remain in good condition.  Would performing a wipe of the board with
an alcohol wipe effect the quality of the print?  Thank you in advance for any
suggestions that you might have.

Sincerely,
Brian Geijsbeek

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