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May 1998

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Subject:
Coplanarity for chip assembly
From:
Debbie Kenney <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 May 1998 11:27:55 -0700
Content-Type:
text/plain
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>  As a manufacturer of flex circuits, pad coplanarity has become a
> major issue for us when our customers assemble the chip onto the flex.
> We are in dire need of information on sources and equipment available
> that can measure coplanarity of copper pads. Is laser or optical
> better?
>
> Any help and / or ideas are greatly appreciated.
>
> Debbie Kenney
> Disk Drive Division
> M-Flex
> [log in to unmask]

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