All,

We are just getting into volume SMT production and I have a 
couple of questions about the benefits of a nitrogen reflow.

1)  Is there a suggested SMT pitch that almost necessitates 
the use of nitrogen (i.e. 20 mil does fine without but 16 
mil needs it...)?

2)  If we are using 100% mil-std finish parts, boards, and 
RMA flux solder paste, are the benefits as great as if we 
were using commercial parts, boards, and a no-clean flux 
solder paste?

3)  One of our customers claims that it increases the life 
of the assembly by eliminating/reducing void formation 
within the solder connection.  Any insight into this?


We are in process of qualifying our SMT equipment, materials 
and processes.  Any suggestions, insight, or lessons learned 
would be greatly appreciated.

Thank you all in advance of your help!!

Steve McBride
[log in to unmask]
(405) 624-5281

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