To All TechNeters,

SUBJETC: HASL alternative.

We are presently analysing some alternatives to HASL. We have some
questions about the OSP alternative.
What happens to the exposed copper for the following cases if the assembly
does not go through a wave process:

- Our products can require that the same PCB allows for variations.
Variations imply that the same PCB can call for all or only  components to
be assembled. When it is required to assemble a variation that excludes a
components, the stencil used in applying solder paste will "hide" the pads.
The OSP is pratically gone at the end of the process. This means that the
pads have no more protection again oxydation !

- What about the vias ?

Thanks in advance for your help.

                          ,,
                       ( . . )
----------o00---O---00o----------------------------------
         Nicolas van der Heyden

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