Hi,

The activity level of the flux in your solder paste influences the extent of
solder balling. As the activity level increases, the wetting force should
increase and the solder should have a greater attraction to the pads and to
itself. Some solder pastes tend to ball more than others. If you are using
one of the modern no-clean products which are on the edge of 10*8 ohms, (if
not under) then you should be able to get away with 1 to 1, but older
no-cleans with lower activity levels certainly require reductions. Why not
tell us what paste you are using and someone is bound to be able to tell you
straight away if you can get away with it.

Regards,

At 16:19 26/05/98 +0000, you wrote:
>Can anyone tell me, would solder balls still occur when you have a
>1:1 ratio between your solder mask and pad.
>
>Any information will be appreciated.
>
>Thanks,
>Edwin Maximo
>Electronic Assemblies Inc.
>(632)7593884
>
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