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May 1998

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Subject:
From:
Lenny Kurup <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 May 1998 09:42:54 -0400
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (53 lines)
Hello Corey,

It is recommended that you not solder over a gold thickness of 30 uins, you
will have gold embrittlement caused by the AuSn, intermetallic. If however,
you reduced the gold thickness to < 10 uins, the solder joints will be
stronger, with soldering to the nickel, beneath, occuring.

Regards,
Lenny Kurup
EMX Enterprises Ltd.

On Mon, 27 Apr 1998, Cory and Lise Steeby wrote:

> We are evaluating a fully gold plated (30uin) connector for a new product.
> I have heard that soldering a gold plated connector to a PCB can cause a
> brittle solder joint because of the intermetallic bonds made between the
> gold and solder.  The assembly is through-hole and wave soldered.  Gold
> plating is required of the contact portion of the connector because of
> environment and signal levels.  I am trying to weigh the gold contact pro
> against the gold solder joint con.
>
> Can anyone verify this or point me to evidence that this is not a problem?
>
> Thank You
>
> Cory Steeby
> [log in to unmask]
>
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