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May 1998

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Subject:
Re: Ni plating and Immersion Au
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 May 1998 08:48:17 -0500
Content-Type:
text/plain
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text/plain (59 lines) 
Hi Frank - No, I wouldn't recommend replacing the nickel with copper.
Copper will diffuse into/through the Ag finish creating an unsolderable
condition after an extended amount of time. The "extended" amount of time
will depend on the storage/use/handling conditions for the parts. You can
find some good info in Klein Wassink's book "Soldering in Electronics" ISBN
0-901150-14-2 on this issue. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





GuitarBud <[log in to unmask]> on 05/02/98 12:42:37 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to GuitarBud <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  Re: [TN] Ni plating and Immersion Au




I am plating stamped 1018-Steel parts with Ni and then Ag.  I am then
soldering them together with 2%Ag solder.  It is roughly 1" x 8".  Should I
use Cu in place of the Ni?

Frank

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