Dennis,

After mounting BGA on a board you can actually test it on ICT using
boundry scan (As is used by Genrad)  test techniques. You can get more
info. On this from Genrad .

Thanks


-----Original Message-----
From:   [log in to unmask] [mailto:[log in to unmask]]
Sent:   Monday, May 04, 1998 3:59 PM
To:     [log in to unmask]
Subject:        [TN] Elcetrical Testing

From: Dennis J Fall@TFT on 05/04/98 02:59 PM


To:   [log in to unmask]
cc:
Subject:  Elcetrical Testing


What are some ways that BGA manufacturers test the BGA's.  I assume
there
must me some way to electrically test the product both for pieces that
have
been mounted to PCB's (customer simulation) and those that have not
yet
been mounted (shipping type tests).  I would think some sort of a
socket
apparatus would be used to test the pieces before they are mounted to
PCB.
But I am not sure how the pieces would be tested after they are
mounted.

Thank You,

--

Dennis Fall

Thin Film Technology Corporation

1980 Commerce Drive

North Mankato, MN 56003-1702



Phone: 507-625-8445 x17

Fax: 507-625-3523

http:\\www.thin-film.com

mailto:[log in to unmask]

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