Hi,TechNetters!

I am trying to find the cause for bond failures between the diode and
the lead after reflow soldering
of smd optocouplers.The failed components are DIP's-modified for SMT.
I am thinking about:
-Profile-the data sheet says only :lead soldering temp:max 260C for 10
sec.
-Drying???
-General incompatibility with the process?
The failure was detected  at electrical testing and verified by X-ray
too-I saw the broken wire
at the wedge bond heel on the lead.
Has anyone ever had a similar problem?
Gaby

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