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May 1998

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Subject:
From:
Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 20 May 1998 06:54:07 EDT
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Hi Joe,
Actually, most chip capacitors that crack, and do not have prior damage up to
placement, crack as the result of too rapid cooling in combination with large
solder fillets (see Klein Wassinks book). A study in Germany, published at
NEPCON West'96 or 95, showed increase in  reliability of chip capacitors with
off-set attachments, because of the resulting smaller fillets. You may want to
make the soldering pads narrower—the width of the CCs ar slightly less and
check how fast you are cooling after the solder wave.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]


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