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May 1998

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 20 May 1998 13:56:22 +1000
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text/plain
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Hi Matthias
I am surprised you put up with the bubbles .
We return them as non conforming to specs., and that is the end of it .
With copy of A black mark in black book on top of it .
As you guessed correctly, without vacuum you can do very little ;
even than the bubbles can push the paste out of syringe ;
you really do not want to get into desperate modes like this .

Your syringes are capped on point with a pin pushing into exit ?
If they have just a screw on cap as most do ( standard EFD tip caps ) ,
that is one way to get the air in .
No fun to bubble on o805's , agree .

Sorry ; no tricks .
I'll forward you contact on Ed Salido ; Philips ; Manila ;
he may know better , doing o402's .

See you                     paul ; ResMed


>----------
>From:  Matthias Mansfeld[SMTP:[log in to unmask]]
>Sent:  Wednesday, 20 May 1998 8:19
>To:    [log in to unmask]
>Subject:       [TN] Getting rid of Air Bubbles in Solder Paste Syringes
>
>Hello Technetters,
>
>I have some solder paste syringes which contain air bubble, probably
>from transport. That means, I have to fight with a bit of overflow
>during dispensing, rather boring with 0805 or SOICs. Pull back flow
>is not so easy to set up with my equipment, thus, the best would be
>to get rid of these bubbles.
>Does anybody know an easy, proven trick? ( I have no vacuum chamber
>available).
>
>Many thanx in advance, regards
>Matthias Mansfeld
>-----------------------------------------------
>Matthias Mansfeld Elektronik
>* Printed Circuit Board Design and Assembly
>Am Langhoelzl 11, D-85540 Haar, GERMANY
>Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
>E-Mail: [log in to unmask]
>Internet: http://home.t-online.de/home/matthias.mansfeld
>
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