Hi Achim! The ANSIJ-STD-002A (to be released shortly) contains a new
solderability test method for components and could be useful for BGA type
components. The Surface Mount Simulation test is basically: printed your
solder paste on a non-reflowable substrate (e.g. ceramic, teflon, etc),
place your component into the paste, reflow, clean, and examine for 95% or
better wetting. This new method has been shown to be very useful for fine
pitch components that bridge if tested with the standard Dip and Look
method. You could do the Surface Mount Simulation method and if the BGA
solderballs are too oxidized I would expect that you would have either very
poor wetting or a "glob" of solder with the BGA solderball sitting on top
of it! Your only complication is that the BGA solderball contains no "lead"
that would have solderability problems - you would be looking for oxide
"skin" issues on the BGA solderball. Some Wetting Balance work has been
attempted with BGA components but the results were unsatisfactory and very
inconclusive. Good Luck.

Dave Hillman
JSTD-002 CoChairman
[log in to unmask]




Achim Neu <[log in to unmask]> on 05/17/98 03:10:38 PM

Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] Solderability Test for BGA







Hello Technet,

many times discussion BGA components with our customer they request a
solderability certification. But I don´t no any standard test of
solderability for BGA´s.

Does anybody know something like solderability test for BGA ?

Any help welcome.

Achim

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