Hello Technetters,

I have some solder paste syringes which contain air bubble, probably
from transport. That means, I have to fight with a bit of overflow
during dispensing, rather boring with 0805 or SOICs. Pull back flow
is not so easy to set up with my equipment, thus, the best would be
to get rid of these bubbles.
Does anybody know an easy, proven trick? ( I have no vacuum chamber
available).

Many thanx in advance, regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://home.t-online.de/home/matthias.mansfeld

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################