TECHNET Archives

May 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Nicolas van der Heyden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 May 1998 11:33:55 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines)
Sorry for my earlier mail without subject
------------------------------------------------------------------------

To all,

We are in the process of buying an automatic stencil (+printed board)
cleaner.
We would like to know if it is compatible with these kind of protective
coating (a
replacement to the HASL with Tin-Lead) or needs some special precaution.

**- OSP (organic solderability preservatives),
**- Au-Ni ,
**- Silver (by immersion).

We will use the MEGASOLV JB cleaning solution.


All information will be very appreciated.

Thanking you

                          ,,
                       ( . . )
----------o00---O---00o----------------------------------
         Nicolas van der Heyden

------------------------------------------------------------

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2