Hello,

I've been seeing boards from some fab vendors recently that have non
wetting of the HAL finish on copper surfaces. Now, according to IPC-6012
(3.5.4.6), if the non wetting is on non soldered surfaces, which is the
case with my boards, 1% of conductor surfaces can have exposed Cu for
class 3. If you count each of the holes we have twice (once for each
side), we have less than that percentage. I'm still not very comfortable
with this, though, so I was hoping someone could tell me the
ramifications of exposed Cu in finished assemblies; it seems like it'd
potentially be a reliability problem potentially. Can someone shed some
light on this?

Thanks,
Matt Sander

Matthew Sanders
PWB Procurement Engineer, Trimble Navigation Limited
[log in to unmask]
Phone: (408) 481-7817
Fax: (408) 481-8590

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