I had experienced them in the past, but now that I've switched fluxes....I
don't have them anymore.  I went through a flux trial to qualify a flux for
our no-clean process.  What kind of flux are you using now?

Jason Smith
Process Materials Engineer
Lexmark Electronics
(606) 232-7667





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Subject:  Re: [TN] Solder Ball?




Alvin Leong wrote:
>
> Hi Technetee,
>         Anyone experience the solder ball appearing in the no-clean
process?
> What is the contributor? I forseen a misprinted PCB on the solder paste
> station is one of it.
> 1. What is the recommendation on the smear board cleaning procedure?
> 2. Ultra-sonic cleaner?
> 3. What type of chemical?
> 4. If an ultra-sonic is the solution, then what is the side impact to
> the package on double-sided process?
>
> Hope anyone can share the info.
>
> Thks.
>
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################################################################Generally,i
n the no clean process, as I understand, solder balls are more
prevalent.
You can try the following to see if it helps:
1.      Lower preheat temperature
2.      Is there sufficient flux on the board?(wave solder)
3.      Soldermask: glossy or matte? The matte masks are less [prone to
solder balls.
4.      Is mask properly cured? Try an extended UV cycle to harden the
mask.
Good luck
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