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May 1998

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Subject:
Re: MICROSECTION MICROETCH
From:
Robisan1 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 4 May 1998 10:53:24 EDT
Content-Type:
text/plain
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text/plain (27 lines) 
Please don't use that etchant.  It is recommended for
a big hunk of copper - but is not recommended for
electroplated copper deposits such as are on printed
wiring boards.

The attack to the copper can and does mask the
presence of cracks and other problems

Hydrogen Peroxide/Ammonium Hydroxide is the
etchant to be used on printed wiring boards for
copper evaluations

Susan Mansilla
Robisan Laboratory

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