For best results when performing pin in paste reflow you should use
convection heating from top and bottom sides of the board. 220 to 230 (230
might be a little too hot but you should go by the max temp rating for the
lowest-temp rated component) should be the max temp seen on the board (when
profiled). Various ovens will have various reflow zone temps to acheive this
due to the differences in thermal energy transfer.
If you would like to discuss further contact me off line.
Sincerely,
Brian Stumm
ETS, LLC
509-483-0900 (voice)
509-483-0331 (fax)
[log in to unmask] (e-mail)
> Hello fellow TechNetters!
> I am setting up IR and convection reflow profiling guidelines for
> this new employer of mine. I know all of the basics for SMT, but I
> have a question I could not find literature on, and could not find in
> the TechNet archives, and would appreciate your experienced opinions:
> I know individual components have Max temp ratings, but as a general
> rule, what are the max temps that one ABSOLUTELY SHOULD NOT EXCEED?
> Now, that probably sounds like a silly question, but we are doing
> work with paste-in-hole and related technologies...large connectors,
> etc.....and I am having to get real creative with profiles, increasing
> temps to handle the mass of the big connectors, which has a tendency
> to get the "chips" a little toasty. I have kept the max temps to 230
> deg C., but please share any info that may be detrimental, such as
> should I be worried about cracking/stressed chip caps at these temps,
> etc.
> Any help is greatly appreciated. Thanx for your TechNet support!
>
> United Technology Electronic Controls
> Jeff L. Hempton, Sr. SMD Engineer
> Huntington, In
> Phone: 219-359-3514
> Fax: 219-358-0695
> E-mail: [log in to unmask]
>
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