Hello fellow TechNetters!
       I am setting up IR and convection reflow profiling guidelines for
     this new employer of mine. I know all of the basics for SMT, but I
     have a question I could not find literature on, and could not find in
     the TechNet archives, and would appreciate your experienced opinions:
       I know individual components have Max temp ratings, but as a general
     rule, what are the max temps that one ABSOLUTELY SHOULD NOT EXCEED?
       Now, that probably sounds like a silly question, but we are doing
     work with paste-in-hole and related technologies...large connectors,
     etc.....and I am having to get real creative with profiles, increasing
     temps to handle the mass of the big connectors, which has a tendency
     to get the "chips" a little toasty. I have kept the max temps to 230
     deg C., but please share any info that may be detrimental, such as
     should I be worried about cracking/stressed chip caps at these temps,
     etc.
       Any help is greatly appreciated. Thanx for your TechNet support!

     United Technology Electronic Controls
     Jeff L. Hempton, Sr. SMD Engineer
     Huntington, In
     Phone:     219-359-3514
     Fax:       219-358-0695
     E-mail: [log in to unmask]

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