Fellow TechNeters,

We manufacture hardware for DOD per ANSI J-STD-001 and I have a couple of
questions regarding solder pots for removing gold from components prior to
tinning and soldering.

We send out solder samples for testing from our tinning and gold stripping
solder pots every thirty days.  To answer the question of "what do you do
with parts that were tinned while the solder pot is being tested (and the
test fails)" we shut the pot down until the test results come back.  The
problem is we only have one gold pot and don't want to shut it down during
testing.  How does your companies address this issue?  Is it fair to assume
that since there is a secondary tinning operation that the small amount of
gold that may remain on the parts will not be a problem?  Do you dump the
pot every thirty days?

My second question is, what is the maximum amount of gold that can be plated
on a terminal and still be soldered into an assembly with only tinning and
not cleaning?  Is there a specification that allows this?

Thanks in advance for all responses.
Ken Bloomquist
Sr. Principal Process Eng.
PRIMEX Aerospace Company
[log in to unmask]
(425) 881-8990 ext. 6645

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